MERSEN’s innovative Power Electronic designs provide the ultimate in low inductance DC power, which is the “life blood”, securing the best suppression of parasitic transients and safe operation for long life.
The MERSEN laminated bus bar is the key component of the DC power circuit, enabling the IGBT / Electrolytic Capacitor circuit to provide perfect power and trouble-free service. Engage MERSEN’s design team on your next project and experience our ingenuity at work.
Thin copper conductors, separated by insulation material of only thousandths of an inch, provides the ultimate in low inductance for IGBT-based motor drives. Incorporating electrolytic capacitors into the same structure simplifies packaging, and reduces the effects of transient overshoots. Note the addition Snubber Capacitors and Resistors built into the laminated bus bar.
Motor Drive Bus Bar
Size: 7” x 9” | Thickness: .040” | Voltage: 475VDC | Current: 150A
Six electrolytic capacitors are easily connected to this edge sealed, two-layer laminated bus bar providing a low inductance power path for a low horsepower, variable speed motor drive. Note the use of a bonded insulator strip along the length of the bus bar to provide additional “creepage” protection between the plus and minus terminals.
Capacitor Bus Bar for Motor Drive
Size: 1.8” x 6.3” | Thickness: .040” | Voltage: 480VDC | Current: 60A
A laminated bus bar assembly consisting of three power layers and one signal layer with a total of 59 conductors providing a very low inductance power path and complete gate drive circuitry all designed for a wave-solder assembly process. This bus bar is used in a system powered by 24 MOSFETs, and includes Electrolytic Capacitors, heatsinks and MOVs.
High Current Inverter
Size: 5” x 7” | Conductors: .060” (gate circuit: .025”) | Volts: 28VDC | Current: 1000A peak
High current circuit board design using laminated technology for IGBTs and support components. Includes gold plating, quick connect mounting. This laminated bus bar is an enhanced designed of a typical IGBT bus bar. Manufactured to be easily serviced, the design uses gold high current sockets, which are soldered into the DC layers. The design also accommodates resistors and MOVs, soldered right into the assembly. Completely edge filled perimeter, the bus bar also has insulated mounting holes.
Spacecraft Power Inverter
Size: 6” x 12” | Thickness: .040” | Voltage: 220V | Current: 75A
Laminated bus bars provide a low inductance connection for capacitors. The assembly was designed for an automated production process and the assembly is the DC capacitor bank used in conjunction with high current, high speed switching applications. Positive and negative layers are formed and laminated without outside insulation. This design includes two rows of capacitors soldered into position.
Mounting Structure for Capacitor Bank
Size: 8” x 8” | Conductors: .030” | Voltage: 63VDC | Current: 300A
Connecting a complex network including Power IGBTs, Diodes, Resistors, and Film Capacitors, this multi-layer epoxy edge-filled bus bar provides a compact low inductance solution. Thirty-two bushings are brazed into position and maintain tightly controlled coplanar mounting surfaces on both top and bottom. Alternating the plus and minus layers throughout the assembly counters the skin effect of high frequencies.
Size: 5” x 9” | Voltage: 115VDC | Current: 125A | Thickness: .030” & .060”
High frequency applications present a unique thermal challenge requiring the addition of water-cooling for efficient operation. When thermal considerations exceed conventional means of heat dissipation, one option is to add water-cooling to the system. This design contains five cooling lines soldered directly on to the epoxy powder coated conductors to maintain a constant temperature. Due to the high frequency of the AC voltage, “skin effect” plays a big role in the heat created from the bus and without this additional cooling, the bus would surely overheat.
High Frequency Inverter
Size: 9” x 32” | Thickness: .030” & .060” | Voltage: 600V | Current: 700A